adhesive bonding process meaning in English
胶合程序
Examples
- Performance for a piezoresistive transducer pressure sensor to thermal and pressure environments can be predicted by finite element method . a simplified 1 / 8 model , considering silicon dioxide and nitride process as well as stack anodic bonding and adhesive bonding processes , was developed . the fem results were found to be comparable to experimental data . case studies suggested that pyrex stack induces certain amount of non - linearity , while it isolates hard epoxy nonlinear effect . flexible epoxy bonding or soft adhesive bonding is preferred to the packaging process . the viscoelasticity and viscoplasticity of bonding material will result in hysteresis and drift errors to sensor output . however , soft adhesive s influence on sensor can be ignored under relative stable environments . more over , detailed design and process information will help to improve modeling application
热、压环境下压阻变换压力传感器的性能可以通过有限元方法预测.这里研究了简化的1 / 8模型,模型考虑了二氧化硅和氮化硅生成过程及堆阳极键合和胶粘结合过程.结果发现有限元预测结果和实验数据具有可比性.范例研究表明,硼硅堆导致产生一定的非线性,但它隔离了硬环氧树脂的非线性.在包装过程中最好使用柔性环氧黏合或软黏胶性结合.黏合材料的黏弹性和黏塑性将会导致传感器输出的滞后和漂移误差.然而,在相对稳定的环境下,软黏合剂对传感器的影响可以忽略.此外,详细的设计和过程信息有助于提高模型的适用性